Alpha Assembly - 249742.0011GM - HiTech CU13-3150 Underfill, 10cc EFD Syringe, 11 gram (MOQ 3)

  • MFR SKU: 249742.0011GM
  • ITEM #: 22391587
  • 0 Reviews / 0 Questions
$25.95
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ITEM #: 22391587
The Alpha 249742.0011GM is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
Alpha 249742.0011GM Features:
Low temperature thermal cure underfill
Low Viscosity due to no filler
Fast Cure at Low Temperatures
Excellent adhesion and Drop Shock performance
Anhydride Free
NON-REWORKABLE
This listing is...
ITEM #: 22391587
The Alpha 249742.0011GM is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
Alpha 249742.0011GM Features:
Low temperature thermal cure underfill
Low Viscosity due to no filler
Fast Cure at Low Temperatures
Excellent adhesion and Drop Shock performance
Anhydride Free
NON-REWORKABLE
This listing is for Syringe
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Alpha Assembly - 249742.0011GM - HiTech CU13-3150 Underfill, 10cc EFD Syringe, 11 gram (MOQ 3)

  • Item #: 22391587
  • MFR SKU: 249742.0011GM

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