Alpha Assembly - 251069.0036GMI - HiTech CF12-4485B Edgebond, 30cc Iwashita Syringe, 36 gram

  • MFR SKU: 251069.0036GMI
  • ITEM #: 22391631
  • 0 Reviews / 0 Questions
$62.95
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ITEM #: 22391631
The Alpha 251069.0036GMI is a one-component, low temperature cure, Edgebond epoxy system designed to provide protection to the solder joint during mechanical stress. ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required. Provides excellent adhesion strength, excellent thermal cycling performance, and multiple curing options. Well suited for consumer electronics assemblies.
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ITEM #: 22391631
The Alpha 251069.0036GMI is a one-component, low temperature cure, Edgebond epoxy system designed to provide protection to the solder joint during mechanical stress. ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required. Provides excellent adhesion strength, excellent thermal cycling performance, and multiple curing options. Well suited for consumer electronics assemblies.
Alpha 251069.0036GMI Features:
Due to the low Tg it is optimally suited for Consumer Electronics / White Goods / Wearables / Medical / Power tools
Excellent Adhesion on FR4 board
Lower Temperature Cure capability
Anhydride Free
NON-REWORKABLE
This listing is for Syringe
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Alpha Assembly - 251069.0036GMI - HiTech CF12-4485B Edgebond, 30cc Iwashita Syringe, 36 gram

  • Item #: 22391631
  • MFR SKU: 251069.0036GMI

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