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Circuit Works - CW2400 - Epoxy Conductive Adhesive & Hardener, 7 Gram Syringe

  • MFR SKU: CW2400
  • ITEM #: 18065548
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ITEM #: 18065548
The CircuitWorks CW2400 is a light gray, epoxy adhesive that comes in a 0.25 oz syringe. The high temperature resistant epoxy is designed to protect electronic circuits and components from corrosion, moisture, oxidation, abrasion, and thermal shock,
CircuitWorks CW2400 Features:
Brand: CircuitWorks®
Series: CW
Product Type: Epoxy Adhesive
Hardness: >70Shore D
Color: Part A:Light Gray, Part B:Sliver/Gray
Primary Color: Part A:Light Gray, Part B:Sliver/Gray...
ITEM #: 18065548
The CircuitWorks CW2400 is a light gray, epoxy adhesive that comes in a 0.25 oz syringe. The high temperature resistant epoxy is designed to protect electronic circuits and components from corrosion, moisture, oxidation, abrasion, and thermal shock,
CircuitWorks CW2400 Features:
Brand: CircuitWorks®
Series: CW
Product Type: Epoxy Adhesive
Hardness: >70Shore D
Color: Part A:Light Gray, Part B:Sliver/Gray
Primary Color: Part A:Light Gray, Part B:Sliver/Gray
Physical Form: Part A:Solid/Paste, Part B:Liquid/Paste
Cure Time: 4h
Shelf Life: 9month
Chemical Composition: Part A:Silver, Reaction Product:Bisphenol-A-(Epichlorhydrin), Epoxy Resin, Part B:Silver, 3, 6-Diazaoctanethylenediamin
Specific Gravity: 4
Odor: Part A:Mild Amine, Part B:Amine
Cure Type: Room 77F
Gel Time: 8 to 10min
Maximum Operating Temperature: +212F
Minimum Operating Temperature: -131F
Container Capacity: 0.25oz
Container Type: Syringe
Applications: Conductive Bonds Between Heat Sensitive Components, Solderless Surface Mount Connections, Circuit Board Trace Repair, Static Discharge and Grounding, Solder Repair, Conductive Structural Adhesions
CircuitWorks CW2400
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Circuit Works - CW2400 - Epoxy Conductive Adhesive & Hardener, 7 Gram Syringe

  • Item #: 18065548
  • MFR SKU: CW2400
  • Brand Name: CircuitWorks
  • ESD-Safe: Yes
  • Series: CW
  • Product Type: Epoxy Adhesive
  • Hardness: >70Shore D
  • Color: Part A:Light Gray; Part B:Sliver/Gray
  • Primary Color: Part A:Light Gray; Part B:Sliver/Gray
  • Physical Form: Part A:Solid/Paste; Part B:Liquid/Paste
  • Cure Time: 4h
  • Shelf Life: 270 Days From Date of Manufacture
  • Chemical Composition: Part A:Silver, Reaction Product:Bisphenol-A-(Epichlorhydrin), Epoxy Resin; Part B:Silver, 3, 6-Diazaoctanethylenediamin
  • Length: 8.5 in.
  • Specific Gravity: 4
  • Width: 5.0 in.
  • Height: 1.0 in.
  • Odor: Part A:Mild Amine; Part B:Amine
  • Cure Type: Room 77° F
  • Gel Time: 8 to 10min
  • Maximum Operating Temperature: +212° F
  • Minimum Operating Temperature: -131° F
  • Container Capacity: 0.25oz
  • Container Type: Syringe
  • Applications: Conductive Bonds Between Heat Sensitive Components, Solderless Surface Mount Connections, Circuit Board Trace Repair, Static Discharge and Grounding, Solder Repair, Conductive Structural Adhesions
  • Storage Conditions: COOL DRY PLACE

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