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Devcon / ITW - 10260-BO - Devcon Potting Encapsulating Compound - 1 lb - 10260

  • MFR SKU: 10260-BO
  • ITEM #: 15382899
  • 0 Reviews / 0 Questions
$164.95
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ITEM #: 15382899
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 35 min working time. Works in a mix ratio of 3:1. Delivers great performance with a shear strength of 2680 psi. Each package contains 1 lb. This potting & encapsulating compound is packaged 1 lb per inner.
This listing is for BOTTLE

Devcon / ITW - 10260-BO - Devcon Potting Encapsulating Compound - 1 lb - 10260

  • Item #: 15382899
  • MFR SKU: 10260-BO
  • Brand : Devcon
  • Chemical Base : Epoxy
  • Material Compatibility : Metal
  • Dielectric Strength : 25 V/mil
  • Cure Time : 16 hr
  • Working Life : 35 min
  • Product Form : Paste
  • Package Size : 1 lb
  • Mix Ratio : 3:1
  • Shear Strength : 2680 psi
  • Storage Condition : Store at Room Temperature

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