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Indium - 800495-250G - Indium Solder 800495-250G Solder Paste, No Clean, 96.5Sn3.0Ag0.5Cu, 8.9HF T-4, 88%, 250g, Jar

  • MFR SKU: 800495-250G
  • ITEM #: 23296329
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$78.95
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ITEM #: 23296329
is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of minimizes false failures in ICT. It is one of our lowest voiding pastes.

Indium - 800495-250G - Indium Solder 800495-250G Solder Paste, No Clean, 96.5Sn3.0Ag0.5Cu, 8.9HF T-4, 88%, 250g, Jar

  • Item #: 23296329
  • MFR SKU: 800495-250G
  • Brand: Indium Solder
  • Alloy: 96.5
  • Package Type: Jar
  • Powder Mesh Size: 4
  • Metal %: 0.8825

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